FeaturesF.P.S. (Fast-Phase Structure)
Larger heatsink base and direct airflow towards lower heatsink block structure to provide a high cooling efficiency with compact heatsink dimensions.
Top Mount Fan
By pointing the airflow of the fan towards the motherboard, Chip sets and MOS-FETs on VR modules can be cooled simultaneously.
V.T.M.S. (Versatile Tool-free Multi platform System)
Improved version of Versatile Tool-free Multi platform System allows multi platform installation without any tools on the latest Intel and AMD sockets.